MID (Molded Interconnect Device)

For component structuring, conductive materials were deposited onto non-conductive material, ex: Three-dimensional structure.

MID componets were widely used in sensors, antennas , RFID and Medical instruments, it applied in Computer, Communication, Consumer Electronic, Medical and Automobile industries.

For example: MID antenna component process

The advantages of MID process
  • Three-Dimensional struture increase flexibility for designing.
  • Solving the problems for micro structure and complicate design level.
  • Simple process.
  • Easy assembly.
  • Reduce the quantities for assembly.
  • Good integrate ability: ex: The antennas integrated with pattern of print circuit board.

Kuang Fa Plating offer two process for MID component to customers:

1. LDS(Laser Direct Structuring) process (patented)

  • Shorten the period for designing.
  • Change the pattern or geometry quickly, more effective and flexible on designing.
  • Speclized plastic material, it need to be planned for mass production.

2. Double Injection Plating process

  • The pattern designing were more precise and reproducible.
  • Increase the flatness of surface.
  • The period of production is short.
  • The wide range of plastic materials for choosing, priceless for customer which bring better solution of MID component to customers.

MID (Molded Interconnect Device)

Application

We challenge ourselves from customer’s demand as our motivation.

MID Process exemplified by Antenna of MID


 

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