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News & Events
- In 2008, we introduce MID (Molded Interconnect Device) process for micro component.
- Our large investment in Pollution treatment and Chemical Recycle system make us become the first plating manufacturer passes the ISO14001 certification.
- In 2008, we will set up the R&D facility of physical vapor deposition, we are doing the research in thermal evaporation and low-temperature sputtering.
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About Kuang Fa Plating Kuang Fa Plating has build its reputation on offering advanced plating process and complete solution for customer’s demand. ..more
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Production Service We offer customers the best solution for their demands.
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Technology Process We stand behind our products and our customer
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