News & Events

  • In 2008, we introduce MID (Molded Interconnect Device) process for micro component.
  • Our large investment in Pollution treatment and Chemical Recycle system make us become the first plating manufacturer passes the ISO14001 certification.
  • In 2008, we will set up the R&D facility of physical vapor deposition, we are doing the research in thermal evaporation and low-temperature sputtering.
  • About Kuang Fa Plating Kuang Fa Plating has build its reputation on offering advanced plating process and complete solution for customer’s demand. ..more

  • Production Service We offer customers the best solution for their demands.

  • Technology Process We stand behind our products and our customer

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